Austin American Technology's HydroJet™ SW (Single Wash) breakthrough advances in cleaning technology bring Progressive Energy Dynamics to the HydroJet™ In-line Cleaning System resulting in unparalleled cleaning power. Developed using complex modeling techniques, this innovative approach to cleaning ensures that each progressive stage in the process optimizes mechanical, thermal and chemical energy to achieve the best possible performance.

Progressive Energy Dynamics (PED)

This unique design, along with Austin American Technology's patented Jet Manifold drying, enables processing of the most complex, high-density assemblies. Available standard in a Mach II+ configuration with a 25Hp blower, the HydroJet™'s drying capability meet increasing throughput demands as your requirements change - without adding to the size of the machine's footprint! Operating at twice the speed of competitive in-line cleaners, the HydroJet™ in-line system also offers easy accessibility and simple maintenance to maximize uptime and productivity.

High Performance Mach Dryer Manifolds

Optimized impingement force and flow management give the HydroJet™ in-line cleaning system the power to out-perform other machines in the toughest cleaning applications, including low-standoff BGAs and µBGAs. Patented high-volume, directed flow drying technology complements the machine's outstanding cleaning capability by efficiently forcing water out of tight spaces and not allowing evaporation to leave behind harmful residues.

Fluid Flow Mechanics: Key to Low Standoff Cleaning
"In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in the available information. Such information is crucial for potential and existing users to fully address the cleanliness level under their respective components. With the emergence of lead free soldering and even smaller components, new challenges have arisen including gaps of less than 1-mil."

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Development and Validation of a new Cleaning Test Platform
"Innovative electronic assembly designs strive to increase functionality over smaller surface areas. Highly dense circuit assembly designs increase the cleaning challenge. Understanding the balance between static chemical and mechanical driving forces is fundamental to predicting and optimizing process variables."

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Cleaning under Flush Mounted Caps
"Removal of flux residue under highly dense chip caps presents a difficult cleaning challenge. Chip caps are flush mounted to the circuit card. Upon reflow, flux residue fills the gap under the chip cap. Cleaning fluids must wet, dissolve, penetrate the flux dam, and flow under the component to adequately remove all flux residues. Increased board density, miniaturization, and Pb-free soldering magnify this problem. To address this problem, process parameters in the form of cleaning temperature, time, cleaning chemistry concentration, and impingement energy must be considered. This paper presents the results from a designed experiment of an advanced cleaning fluid combined with an optimized inline spray-cleaning machine for removing flux residue under flush mounted chip caps"

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Optimizing Cleaning Energy in Batch and Inline Spray Systems
"Removal of flux residue under highly dense chip caps presents a difficult cleaning challenge. Chip caps are flush mounted to the circuit card. Upon reflow, flux residue fills the gap under the chip cap. Cleaning fluids must wet, dissolve, penetrate the flux dam, and flow under the component to adequately remove all flux residues. Increased board density, miniaturization, and Pb-free soldering magnify this problem. To address this problem, process parameters in the form of cleaning temperature, time, cleaning chemistry concentration, and impingement energy must be considered. This paper presents the results from a designed experiment of an advanced cleaning fluid combined with an optimized inline spray-cleaning machine for removing flux residue under flush mounted chip caps"

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