Fluid Flow Mechanics: Key to Low Standoff Cleaning
"In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in the available information. Such information is crucial for potential and existing users to fully address the cleanliness level under their respective components. With the emergence of lead free soldering and even smaller components, new challenges have arisen including gaps of less than 1-mil."

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"Innovative electronic assembly designs strive to increase functionality over smaller surface areas. Highly dense circuit assembly designs increase the cleaning challenge. Understanding the balance between static chemical and mechanical driving forces is fundamental to predicting and optimizing process variables."

"Removal of flux residue under highly dense chip caps presents a difficult cleaning challenge. Chip caps are flush mounted to the circuit card. Upon reflow, flux residue fills the gap under the chip cap. Cleaning fluids must wet, dissolve, penetrate the flux dam, and flow under the component to adequately remove all flux residues. Increased board density, miniaturization, and Pb-free soldering magnify this problem. To address this problem, process parameters in the form of cleaning temperature, time, cleaning chemistry concentration, and impingement energy must be considered. This paper presents the results from a designed experiment of an advanced cleaning fluid combined with an optimized inline spray-cleaning machine for removing flux residue under flush mounted chip caps"

"Removal of flux residue under highly dense chip caps presents a difficult cleaning challenge. Chip caps are flush mounted to the circuit card. Upon reflow, flux residue fills the gap under the chip cap. Cleaning fluids must wet, dissolve, penetrate the flux dam, and flow under the component to adequately remove all flux residues. Increased board density, miniaturization, and Pb-free soldering magnify this problem. To address this problem, process parameters in the form of cleaning temperature, time, cleaning chemistry concentration, and impingement energy must be considered. This paper presents the results from a designed experiment of an advanced cleaning fluid combined with an optimized inline spray-cleaning machine for removing flux residue under flush mounted chip caps"

The MicroJet™ Inline cleaning System with Progressive Energy Dynamics™ provides the highest level of SMT cleaning available on the market today.Progressive Energy Dynamics (PED™) is a proprietary spray bar design that is the result of years of research and development. Independently targeted precision flow jets impact all four sides of circuit card assemblies removing trapped flux residues from around and under SMT components.

	MicroJet™ FC: Semi Aqueous MicroJet™ EC: Water-Only
	HydroJet™ SW: Semi Aqueous HydroJet™ DW: Semi Aqueous HydroJet™ Solar: Solar Panel Cleaner